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init_uart: ldi rtemp, baudrate ;set baud rate out UBRR,rtemp ldi rtemp, $18 ;initialize UART control register out UCR, rtemp ret ;******************************************************* ;RXCOMP: Receive a byte from the serial port ;polls the RXC flag in the UART Status Reg (USR) ;if 1 , then data is read from the UART Data Register (UDR) ;******************************************************* rxcomp: sbis USR,RXC ;poll to check if char received rjmp rxcomp in rreg,UDR ;put received data in rreg ret ;******************************************************* ;TXCOMP: Transmit a byte from the serial port ;polls to see if the UDRE flag is 1 . If 1 then ;a byte is written to the UDR to be transmitted. ;******************************************************* txcomp: sbis USR,UDRE ;poll to check end of transmission rjmp txcomp out UDR, treg ret

Component Compatibility Not all components are compatible with the water-wash process Circuit board mounted switches are notable in this regard Even some switches sold as environmentally sealed or water-wash compatible have been found to leak during the high-pressure wash spray or submersion steps of aqueous cleaning This can result in failure of the switch to work properly (the water causes an electrical short within the switch) or, if there is enough ionic content in the wash water or in the switch itself, switch contact corrosion may occur in the long term Many circuit assemblies are very dense with partsThe higher the part density, the less effective aqueous cleaners are Like stones in a stream, the water swirls around them and eddy currents of relatively stagnant water form behind the stones.

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Components on a circuit board act in the same way, as they block the free flow of water and impede proper rinsing even in the most turbulent water spray systems To counteract this, aqueous wash machines have multiple spray nozzles directed at board surfaces in several directions and angles Many components have low headroom spaces beneath them, inhibiting rinsing effectiveness In the case of PGAs, ball grid assemblies (BGAs), ceramic column grid arrays (CCGAs), ceramic ball grid arrays (CBGAs), etc, the water s path is further frustrated by the presence of solder joints beneath the component Increasing I/O count, increased package size, and decreasing space between the PWB and component underside make water washing all the more difficult The same issues hold true for chip-scale packages (CSPs) where the headroom is little more than a capillary and good washwater exchange is unlikely.

High-density, multirow connectors are also difficult to rinse All of the preceding are equally difficult to dry Water beneath components or within components may interfere with in-circuit test or functional test results immediately following aqueous cleaning Water from aqueous wash has been known to enter integrated circuit (IC) encapsulant vent holes and cause shorts internal to the IC (see Fig 464)..

(Contd)

FIGURE 46.4 If water enters an improperly sealed encapsulant vent/fill hole on an IC package, shorting or corrosion can occur. (Courtesy of Hewlett-Packard.)

Manufacturing Impact of Water-Clean Process There are significant issues to consider when using water-clean fluxes, and the decisions are dependent on the specific parts and final product:

Expense Aqueous washers are expensive and require a large footprint on the manufacturing floor. Generally, high-purity, de-ionized water is used instead of tap water to enhance rinsing effectiveness and to minimize corrosion or shorts caused by tap water particulates or ionic species such as chlorine or fluorine as found in treated public water supplies. Additional process steps Washing represents several additional handling steps, and with each handling step comes risk to the board. Due to the force of the water jets in the cleaning machine, boards, especially smaller ones, are put in baskets or carriers to go through the water-wash process. This involves additional materials (baskets/carriers) and handling. There is ample opportunity to knock parts off the board during loading or unloading of these baskets. Occasionally tall parts (such as surface-mount capacitors) are blown off the board by the force of the water blast. Boards that somehow escape the water-wash process will develop corrosion in short order. Additional labor Besides the need for additional operators to load and unload the conveyorized wash machine, increased maintenance is required for the aqueous cleaning machine, de-ionized water system, and waste-water treatment. Environmental impact The de-ionized water system requires frequent monitoring and filter replacement. Solder fines washed off the PCA must be filtered from the waste-water stream, and dissolved metals and other species harmful to the environment must be monitored and removed if of a high enough concentration before releasing spent water to the drain. This process is not suited to geographies with water shortages, water restrictions, or poor-quality water, or where the cost of water is high.

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